Dicyandiamide-micropowder

Production introduction

Micropowder dicyandiamide features and applications :

The main differences between micronized dicyandiamide (micro powder dicyandiamide) and ordinary dicyandiamide in particle size, dispersion, application fields, and standard specifications: Particle size and dispersion: Micronized dicyandiamide has undergone a micronization process, the particle size to about 10μm, and a certain amount of dispersant is added, which has better miscibility and solves the problem of traditional dicyandiam being difficult to disperse evenly in epoxy resin .

Application fields: Micronized dicyandiamide can be applied to epoxy solid adhesives epoxy resin adhesives, composite carbon fiber prepregs, powder coatings, thermosetting inks, PCB printing resist ink systems, and can be applied to, automobiles, aerospace, marine engineering, heavy corrosion protection and other fields. The application range of ordinary dicyandiamide is relatively wider, including fertilizers, nitcellulose stabilizers, rubber vulcanization accelerators, etc..

Standard specifications: At present, there is a lack of unified standard for micized dicyandiamide in the market, and the technical standards of various enterprises are uneven. Ordinary dicyandiamide is divided into three grades: superior grade, grade, and qualified grade according to HG/T3264-1999 standard, while electronic grade dicyandiamide has higher requirements for main content impurity content.

In summary, micronized dicyandiamide has better performance in specific application fields, but its market standards are still in the process of and improvement.